Product description
Semiautomatic hybrid Rework station for repairing BGA, CSP and QFP components on medium-sized circuit boards
The Rework Station with 3,300W hybrid under heater. The heating area of 275 x 245 mm² is adjustable to PCB size. Automated SMD placement process by Auto Vision Placer (AVP) incl. EASYSOLDER software package and DBL 06. control unit with six high resolution sensors inputs for thermocouples (Type K). This system is particularly suitable for mid-size and large PCBs with fine-pitch components of varying package dimensions.
Top Features
Camera-supported rework
Flexibility
Various PCB sizes and shapes as well as components available
Under-heating system
Highest energy density for thermally demanding boards.
Performance
Uniform heat distribution through convection and hybrid technology
Multifunctionality
One device for all processes, including de-soldering, pad cleaning, automatic positioning and soldering
Software
Simple, intuitive, tablet-compatible
Precision
Precision of placement within 15 µm
Standard equipment
- Tool set for dispensing, placing, residual solder removal and soldering with magazine
- Set of placement nozzles (BGA/CSP) 3 mm, 5 mm, 8 mm, 10 mm
- Set of solder nozzles (BGA) 15 mm, 27 mm, 35 mm, 40 mm
- Two camera lenses (BGA und CSP)
- Two thermocouple sensors (type K)
- Four PCB magnet holder 40,5 mm (standard)
- Two PCB clips to install at hand rest
- Foot switch
- Intuitive software EASYSOLDER 07 with touch integration
Components
LED rework /Daughter boards Interposer boards/ Sub assemblies /RF frames /RF shields Rework on flex /Small passives down to 0402 /SON /PGA /LGA /QFP /PoP /DFN /QFN/ µBGA/CSP /BGA Sockets /Connectors /CPU /Under-filler or coated components /Film capacitor.
Contact us for more information or receive a quate!
