• Netser-Sereni 70395, Israel

ASI | IR710+ SMD BGA Rework System

Product description

  • Microprocessor-controlled ESD safe unit.
  • Utilizes infrared heat wave technology.
  • Easy-to-adjust IR and pre-heat temperatures with digital display.
  • Embedded pre-heating station.
  • Widely used for reworking BGAs, micro BGAs, QFPs, PLCCs, SOICs, small SMD, and other circuit board components.
  • Unique, innovative mechanical design for more precise soldering; eliminates the displacement of surrounding components brought by unnecessary or accidental movements during reworking.
  • Integrated hands-free IR gun.
  • Centigrade and Fahrenheit switchable.

Additional information

Manufacturer

Specifications

WEIGHT: 8 kg
MAIN STATION DIMENSION: 192 x 100 x 325 mm
PRE-HEATER
POWER CONSUMPTION:   500W
TEMPERATURE RANGE:   100°C- 450°C
HEATING ELEMENT:   Quartz Crystal
INFRARED SOLDERLIGHT GUN
POWER CONSUMPTION:     200W
TEMPERATURE RANGE:    100°C – 420°C
HEATING ELEMENT:     Halogen Light Source

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