Pillarhouse | Orissa Fusion, Selective Soldering System

Product description

High speed, in-line, multi-platform selective soldering system

Incorporating high speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offerings.
The standard four station cell can be configured to handle PCB’s up to 381mm x 460mm – fluxer, preheat, solder, solder. For high speed applications this same unit can be configured as fluxer/preheat and up to three solder modules with as many as five heater options.

An optional PCB transfer station and return conveyor enables product to be manually unloaded adjacent to the conveyor load station – this configuration reduces PCB handling capability to 381mm x 250mm.

Each solder cell can be configured with any of the currently available Pillarhouse solder technologies: custom-dip, multi-dip, Jet-Wave and single point AP down to the patented 1.5mm micro nozzle.

Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.

Standard Features

In-line motor driven width adjust through feed conveyor
Conveyor side clamping
DC servo drives with encoders on X, Y & Z axis
Integral PC and machine mounted TFT monitor
Inerted Nitrogen system
Automatic fiducial correction system
Motorised wire feed auto solder top-up & solder level detect
Drop-Jet fluxer
Solder wave height measurement and correction system
Process viewing camera
Multiple level password protection
Solder bath coding – identifies correct bath for program
Thermal nozzle calibration system using integrated setting camera (requires manual correction)
Six AP solder nozzle tips
Internal fume extraction
Colour programming camera
PillarCOMM Windows® based ‘Point & Click’ interface
PillarPAD offline programming system
Lead-free compatible
Day-to-day service kit

Monitoring Options

Flux presence sensor – thermistor style
Flux spray, flow and spray & flow
Pump rpm
O2 ppm
Nitrogen flow

System Options

Ultrasonic fluxing
Dual Drop-Jet / ultrasonic fluxing
Top-side instant IR preheat
Bottom-side IR preheat
Closed loop pyrometer temperature control
Large solder bath for dedicated single dip applications
Laser PCB warp correction
5mm micro nozzle
Solder reel identification
Larger PCB handling size
Nitrogen generator

P/N 62210

Additional information

Manufacturer	Pillerhouse

Specifications

Height	1390mm to 2045mm – with light stack
Width	2193mm Compact 2930mm Standard
Depth	1520mm 1740mmm with flux bottles
Board size	381mm x 460mm (Standard frame with 4 stations) Larger PCB size available upon request
Edge clearance	Above / below 3mm
Height clearance	Above / below 40mm nominal, 70mm max
Solder	Most commonly used solder types – including lead-free
Solder pot capacity	20kg standard – 30kg large bath
Applicators:	AP style – 2.5 – 16mm dia. Extended and Jet-Tip nozzles – up to 25mm dia. Jet-Wave nozzles – up to 25mm width Special dedicated nozzles available upon request
Flux	Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
X, Y & Z Axis resolution	0.15mm
Repeatability	+/- 0.05mm
Nitrogen usage	40 litres gas/min per bath using single bath with standard AP solder nozzle, 5 bar / 72 psi pressure.
Nitrogen purity	99.995% or better
Air supply pressure	5 bar / 72 psi
Power supplies	Three-phase + neutral + PE
Voltage	230 V phase to neutral / 400V phase to phase
Frequency	50/60Hz
Power :	Machine configuration dependent – contact your local Pillarhouse representative
Transport	Motorized conveyor
Programming	PillarCOMM Windows® based ‘Point & Click’ interface