Product description
Rework Station with 5,300 W hybrid under-heating system. The heating area of 450 x 420 mm2 is adjustable to PCB size. Automated SMD placement process by Auto Vision Placer (AVP) incl. EASYSOLDER 07 software package and DBL 06 control unit with six high resolution sensors inputs for thermocouples (Type K).
This system is particularly suitable for large size PCBs like PCs, Laptops and Server Boards with small up to very big components.
Top Features
Camera-supported rework
Flexibility
Various PCB sizes and shapes as well as components available up to 75 x 75 mm2
Under-heating system
Large PCBs 480 x 480 mm2
Performance
Uniform heat distribution through convection and hybrid technology
Multifunctionality
One device for all processes, including de-soldering, pad cleaning, automatic positioning and soldering
Process control
Automatic profiler for under- and top-heating systems
Software
Simple, intuitive, tablet-compatible
Standard equipment
- Tool set for dispensing, placing, residual solder removal and soldering with magazine
- Set of placement nozzles XL-type (BGA/CSP) 5 mm, 8 mm, 15 mm with O-Ring
- Set of solder nozzles (BGA) 15 mm, 27 mm, 35 mm, 40 mm
- Two camera lenses (BGA und CSP)
- Two thermocouple sensors (type K)
- Four PCB magnet holder 40,5 mm (standard)
- Three PCB clips to install at hand rest
- Foot switch
- Manual
- Intuitive software EASYSOLDER 07 with touch integration
Components
LED rework/Daughter boards/Interposer boards/Sub assemblies/RF frames/RF shields/
Rework on flex/Small passives down to 0402/SON/PGA/LGA/QFP/PoP/DFN/QFN/µBGA/CSP
BGA up to 67x67mm/Sockets/Connectors/CPU/Under-filler or coated components/Film capacitor.
Contact us more information or receive a quate!
