• Netser-Sereni 70395, Israel

Manual Selective Soldering System- MS-10

Product description

Manual Selective Soldering System

Can be used for the removal and replacement of through- hole components, connectors, etc. mounted on PC boards

  • Digital controller -Microprocessor based,
  • “Blow- thru” hot air nozzle option removes solder remaining in through-holes during rework process
  • X, Y, & Z Universal Board Fixture option allows quick and easy board positioning over the wave
  • Overhead locator laser light pinpoints position for centering component over the wave
  • A large selection of nozzles for all component sizes is available. (14-20 pin DIP standard)
  • Height adjustable stainless steel platform
  • Easy to change bayonet mount nozzles for a variety of rework or selective soldering applications.

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Specifications

MS-10 Specifications
120 VAC, 60Hz, 15 A optional 220 VAC, 50/60 Hz, 8 A Power
662°F (350°C) Max solder temp
50 lbs (23 Kg) Solder Capacity
60 PSI (4 bar) Compressed Air (MS-10A only)
16” x 26” x 17” (406 x 660 x 432mm) Dimensions
Approx. 30-45 min Warm-up time
30 lbs empty (13.5 kg), 80 lbs (36 Kg) with solder Weight
Solder Fountain MS-10
Solder Fountain with blow- through air nozzle MS-10A

 

Device Type Available Nozzle Sizes Wave Nozzle Air Nozzle
14-20 pin DIP 1.00” x 0.50” (25 x 13mm) WN-10 AN-10
24-28 pin DIP 1.50” x 0.75” (38 x 19mm) WN-20 AN-20
30-48 pin DIP 2.50” x 0.75” (64 x 19mm) WN-30 AN-30
PGA 1.00” x 1.00” (25 x 25mm) WN-40 AN-40
PGA 1.50” x 1.50” (38 x 38mm) WN-50 AN-50
PGA 2.00” x 2.00” (50 x 50mm) WN-60 AN-60
Flat connectors 2.75” x 0.35” (70 x 9mm) WN-70 AN-70
Large connectors 4.00” x 0.75” (102 x 19mm WN-80 AN-80
Custom nozzles available (5 in² max., e.g. 1.25” x 4”)

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