Product description
The winning combination for smart, cost-effective electronics manufacturing
In a world where raw material costs are rising especially the price of silver-there’s no reason to keep using SAC305 when a more reliable, stronger, and more cost-effective alternative exists.
We are proud to launch in Israel REL61™,
AIM Solder’s innovative lead-free solder alloy, fully synergized with proven M8 flux chemistry, delivering one clear result: higher reliability at a lower cost.
The simplest transition – a true Drop-In Solution
No need to change the “recipe” that already works for you. Switching to REL61 is seamless:
- Same chemistry: The proven M8 flux remains unchanged.
- Same reflow profile: A lower melting range (208°C–215°C) enables use of existing profiles with minimal risk.
- Full process stability: The same print stability and long stencil life you already know from M8.
Market-leading reliability – not just meeting the standard
- Thermal cycling performance: Comparable to SAC305 from -40°C to +125°C.
- Drop shock resistance: About 25% improvement SAC305 in Drop Shock testing, thanks to a refined grain structure.
- Low voiding: Exceptionally low void levels in QFN and BGA components-well below IPC requirements.
Direct, measurable savings – over 30% in paste cost
- Immediate ROI: Reduced silver content delivers significant, direct savings on paste purchasing-without technological compromise.
- Component protection: Lower process temperatures help protect sensitive components and reduce warpage on thin boards.
- Inspection efficiency: Smooth, shiny solder joints support AOI performance and reduce false calls.
Switching to REL61 on the M8 platform enables you to lower BOM costs while improving your product’s mechanical reliability.
