Product description

Low Voiding: as low as 1% on BGA and <5% on BTCs
Capable of Consistent Printing with Area Ratio <0.66
High Reliability (SIR)
Drop-in for M8
REACH and RoHS* Compliant
Available in SAC305 T4
DESCRIPTION
V9 No Clean solder paste is formulated for near-zero voiding on
BGA, BTC and LED soldering applications. Significant void
reduction achievable on all surface finishes including ENIG, ImSn
and OSP. V9 exhibits stable print performance on fine feature

devices over 12 hours. V9 post-process residue is easily pin-
probed and has high SIR values.