• Netser-Sereni 70395, Israel

ASI | HOTBAR Pulsed Heat HBR/HSC/ACF Bonding System

Product description

  • Realtime temperature and force profile display on the LCD touch screen.
  • Titanium alloy thermode ensure uniform temperature distribution, fast
  • heating and longest service life.
  • Password protection for process and system parameters.
  • Level mechanism for components co-planarity adjustment.
  • English / Simplify Chinese / Traditional Chinese user interface display.

OPTIONS

  • Tape Feeding System (TFS1) for holding silicon or Polyimid (Kapton) tape.
  • Colour (CC19) alignment module for TAB/flex to PCB/LCD.
  • Thermal Profiling Unit (TPU1); additional thermocouples for temperature profile monitoring.

Additional information

Manufacturer

Specifications

      Questions about this product? Contact Us
      צוות המומחים שלנו ישמח לעמוד לשירותכם
      לייעוץ ומידע נוסף השאירו פרטים: