The ASI VENTHERM Reflow Ovens provides controlled convection reflow soldering for
SMT production, with independently programmable heating zones and touchscreenbased
process control.
Available in two configurations, the series provides a choice between the compact
VENTHERM C3 with three top and three bottom heating zones, and the productionoriented
VENTHERM P5 with five top and five bottom heating zones.

ASI VENTHERM P5
Production 5-Zone Inline Reflow Soldering Oven
Production-oriented inline configuration featuring 5 top and 5 bottom independently
programmable heating zones, support for PCB widths up to 330 mm, and a 1745 mm
heated tunnel. The system supports a mesh-belt or edge-pin conveyor and optional
SMEA conveyor extensions.