Product description

The ASI VENTHERM Reflow Ovens provides controlled convection reflow soldering for
SMT production, with independently programmable heating zones and touchscreenbased
process control.
Available in two configurations, the series provides a choice between the compact
VENTHERM C3 with three top and three bottom heating zones, and the productionoriented

Compact 3-Zone Reflow Soldering Oven
Compact configuration featuring 3 top and 3 bottom independently programmable
heating zones, a maximum PCB width of 250 mm, and an 850 mm heated tunnel.

• Independently programmable heating zones
• 8-inch Android-based capacitive touchscreen controller
• Maximum operating temperature of 320°C
• Compatible with most leaded and lead-free solder paste profiles
• On-board reflow profiling with support for up to 3 thermocouples
• Programmable conveyor speed, heating temperature, convection heat flow and cooling fans
• Plenum convection heating technology for uniform temperature profiling across the PCB
• Storage for up to 100 individual profiles
• Real-time graphical temperature display
• Password protection
• USB flash-drive data logging
• Status light tower
• Low-mass stainless-steel conveyor
• Clamshell hood design with mechanical strut
• RS232 PC interface
• Optional nitrogen capability