Product description

The SMART DESOLDER combines a manual hot gas source with a vacuum pen for extraction of residual solder. Damage to the pads from overheating or mechanical stress is avoided through targeted heating of the residual solder after lifting the component.

• The temperature-controlled airflow prevents the neighboring components from warming up.
• After melting, the residual solder is removed contactless by the vacuum pen.
• The soft Teflon tip prevents damage to the pads through mechanical demands.
• As a standalone device, it virtually fits on any work bench and can be operated very flexibly with two handheld pens.
• The HOTBEAM 04 / 05 under-heating system perfectly completes the SMART DESOLDER 01. Through this combination, the temperature behavior can be optimized by way of a sensor-supported or programmed preheating profile.

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