Product description
Reliable processes with and without vacuum
In condensation reflow soldering with the CondensoX-Series, soldering is accomplished with the aid of a hot vapour as well as the medium Galden®. Since the heat transfer in condensation soldering is up to ten times higher than with convection soldering it is particularly suitable for handling large or high-mass boards. The use of a patented injection process and the flexible adjustment of temperatures and pressure allows the soldering procedure to be individually regulated. With the new CondensoXC Rehm increases its product range with a powerful system for laboratory applications, small lot sizes and prototyping.
An optional vacuum module ensures void-free soldering with all models of the CondensoXC – Series.
Features:
- Injection principle (repeatable control of the reflow profile)
- Hermetically sealed process chamber
- Controllable vacuum process – pre-vacuum and vacuum after soldering possible
- Manual loading from frontside
- No Galden® loss, active Galden® filtering
- Optional process monitoring (traceability) with the wireless WPS system
