Product description
Advanced surface activation for enhanced adhesion and cleanliness in automated SMT and microelectronics production.
PVA’s atmospheric plasma systems deliver high-performance point or rotary plasma to remove organic contaminants and significantly increase surface energy. This ensures superior adhesion of adhesives, underfills, die bonds, and coatings, while improving product reliability and yield. Plasma treatment has become a standard in critical electronics, automotive, and medical applications, including flip-chip and wafer processing.
Key Benefits
- Enhances adhesion for coatings, underfills, die & wire bonds
- Cleans micro-contaminants from PCBs, substrates, wafers, and carriers
- Supports inline & robotic integration (SMEMA/PLC compliant)
- CFR 21 Part 11-ready with audit-trail and recipe logging
- Modular: point, rotary, or inline configurations
- Calibrated gas mix, power, and process time for each specific application
Typical Applications
- SMT boards, substrates & components
- Optical & conformal coating preparation
- Medical & aerospace electronics
- Automotive die bond & wire bond enhancement
- Flip-Chip underfill: improves wetting, capillary flow, and yields
Note: Maximum effectiveness requires precise calibration of gas composition, power, and exposure time for each application. PVA offers full support in process development, calibration, and integration to ensure optimal performance.
