Product description
This equipment is designed for cleaning of heavily contaminated soldering frames and frames for soldering wave processes. The applied technology is based on alkali process. The machine is provided with three chambers, where cleaning, rinsing and drying with natural air flow are performed.
Cleaning process has three phases
- Dissolving of contaminants in the cleaning medium (10 minutes)
Contaminants are softened and then dissolved. The contaminations fall off from the surface as a gelatine-substance at alkali technology. The contaminants drift as sediment to the bath ground at alkali cleaners and falls off as flakes at MPC cleaners. This process is accelerated by using of pressure air blasting into the bath.
- Washing process (10 minutes)
Washing by immersion in the second bath is important for reaching of the optimum cleanliness. For the best washing result is used pressure air blasting into the bath ground. For washing of stencils is recommended DI water, for washing of soldering frames can be used city water.
- Drying process
The third chamber is equipped as stacker place for natural air flow drying.
P/N58200
