AIM - ASI Technologies

AIM Solder | NC257MD Jet Printing Solder Paste

ASI Specialist — Mon, 12 Sep 2022 10:14:19 +0000

Features:

– Specially Engineered for Mycronic Jet Printers

– Clear Pin-Probe Testable Residue

– Excellent Wetting, Even Leadless Devices

– Reduces Voiding Under Micro-BGAs

– 8-12 Hour Tack Time

– Vapor Phase Compatible

– For Use With Mycronic AG Type Ejector

NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC257MD prolongs ejector life and reduces paste scrap and consumption. The superior wetting ability of NC257MD results in bright, smooth and shiny solder joints and reduced voiding on BGA and BTC devices. NC257MD produces low post reflow flux residues, which remain crystal clear and easily probed even at the elevated temperatures required for lead-free alloys.

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AIM | V9 NO CLEAN SOLDER PASTE

ASI Specialist — Sun, 10 Jul 2022 13:38:47 +0000

Low Voiding: as low as 1% on BGA and <5% on BTCs
Capable of Consistent Printing with Area Ratio <0.66
High Reliability (SIR)
Drop-in for M8
REACH and RoHS* Compliant
Available in SAC305 T4
DESCRIPTION
V9 No Clean solder paste is formulated for near-zero voiding on
BGA, BTC and LED soldering applications. Significant void
reduction achievable on all surface finishes including ENIG, ImSn
and OSP. V9 exhibits stable print performance on fine feature

devices over 12 hours. V9 post-process residue is easily pin-
probed and has high SIR values.

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CX18 NO CLEAN CORED WIRE SOLDER

Keren — Mon, 28 Feb 2022 10:19:36 +0000

DESCRIPTION
CX18 is a no clean flux core wire solder designed to offer excellent soldering results with all alloys and on all surface finishes.
Engineered for high operator satisfaction CX18 is a low odor/smoke formula which promotes thermal transfer, and fast wetting without
the need for additional flux. CX18 post solder residues are minimal, clear and pass IPC-004A and IPC-004B SIR and corrosion requirements.

STANDARD AVAILABILITY
CX18 is available in multiple lead-free alloys. Additional alloys and diameters may be available upon request.

APPLICATION
Best results are obtained with a properly sized solder iron tip at a temperature between 300° – 400°C (575° – 750°F) for leaded alloys and 370° – 425°C (700° – 800°F) for lead-free alloys. If additional flux is required AIM NC280 liquid flux or NC217 gel flux are recommended.

CLEANING
CX18 can be cleaned with commercially available flux removers. IPA is not recommended. Contact AIM for specific information.

SAFETY
Use with adequate ventilation and proper personal protective equipment. Refer to the accompanying Safety Data Sheet for any specific emergency information. Do not dispose of any hazardous materials in non-approved containers.

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RX18 NO CLEAN CORED WIRE SOLDER

Keren — Mon, 28 Feb 2022 09:41:07 +0000

RX18 no clean flux core wire solder was developed to provide excellent soldering results with all alloys and surface finishes.

Engineered for robotic soldering, RX18 promotes thermal transfer, fast wetting and rapid solder penetration into plated through holes or surface mount interconnections.

RX18 specialized packaging ensures consistent, accurate, jam-free wire feeding.

RX18 post solder residues are minimal, clear and pass IPC-004A and IPC-004B SIR and corrosion requirements and do not require cleaning.

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AIM | No-Clean Cored Wire, CX18, New!

kramer.niels — Mon, 13 Apr 2020 16:22:29 +0000

CX18 is a no-clean flux core wire solder designed to offer excellent soldering results with all alloys and on all surface finishes. Engineered for high operator satisfaction CX18 is a low odor/smoke formula that promotes thermal transfer, fast wetting without the need for additional flux. CX18 post solder residues are minimal, clear and pass IPC-004A and IPC-004B SIR and corrosion requirements.

Features:

Fast Wetting
Minimal/Clear Residue
Extends Solder Tip Life
ROL0 per IPC J-STD-004
REACH and RoHS Compliant*
Low Odor / Fumes
Halogen-Free per EN14582

The post AIM | No-Clean Cored Wire, CX18, New! appeared first on ASI Technologies.

AIM | Specialty Alloys

kramer.niels — Mon, 01 Apr 2019 17:55:29 +0000

AIM specialty alloys consist of, but are not limited to, Indium, Bismuth, Cadmium, Gold and Gallium. The term “specialty” is used to describe solders that do not meet the standard tin-lead temperature range. AIM has developed solder products that meet customer needs on either side of 183°C.

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AIM | Surface Mount Epoxy 4044

kramer.niels — Sat, 05 Jan 2019 10:25:02 +0000

Epoxy 4044 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4044 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equipment or positive displacement pump systems, and quick cure properties when exposed to heat. Viscosity and surface tension of Epoxy 4044 are adequate for use with high speed placement equipment.

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AIM | SAC305 SMT Reels

kramer.niels — Fri, 28 Sep 2018 07:40:07 +0000

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AIM | RMA Cored Wire

zivit.drori — Wed, 30 May 2018 15:24:03 +0000

RMA is a mildly activated, general-purpose wire solder for use in applications requiring good activation. RMA cored wire is active enough for excellent tarnish or oxide removal, and will produce bright shiny solder joints. RMA wire will leave slight to moderate post-process residues that may be left on noncritical applications, but should be removed from any critical applications. RMA cored wire meets Mil-Spec cleanliness requirements without cleaning. IPC flux classification for this material is ROL0.

Features:

Good Activity Level
Mildly Activiated Flux
Good Wetting Properties
Good Thermal Transfer
Glycol-Free
Available in Industry Standard Sizes

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AIM | NC273 LT Solder Paste

zivit.drori — Wed, 30 May 2018 15:20:08 +0000

The revolutionary activator system in AIM’s new NC273LT low temperature solder paste improves the wetting performance of bismuth alloys to RoHS compliant plating and surface finishes, while ensuring long stencil life, excellent transfer efficiencies and minimizes solder balling common to high bismuth materials. The majority of lead-free solutions require higher processing temperatures than their lead bearing predecessors. In some cases, these higher temperatures cannot be tolerated by other materials in the assembly. When thermal exposure during the assembly process is a limitation, NC273LT solder paste for bismuth bearing alloys is an excellent RoHS compliant replacement. Bismuth bearing solder pastes can reduce peak reflow temperature requirements to as low as 170°C – 175°C (340°F – 350°F). AIM’s NC273LT solder paste formula with bismuth containing alloys can provide an assembler with an innovative solution when temperature sensitivity is paramount.

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AIM | M8 Solder Paste

zivit.drori — Wed, 30 May 2018 15:18:54 +0000

M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGA and reduced voiding on QFN/BTC components while producing bright shiny solder joints. M8 leaves minimal, high purity, residue, engineered to be safely left in place. Developed with the input of coating and cleaning industry partners, residues can be directly coated or easily removed.

Features:

Halogen-free
Low voiding on BGA and BTC components
REACH and RoHS compliant
For use with demanding, high density electronic assemblies
High SIR/Electrically safe residue
Formulated for use with T4 and finer powders
Mitigates head-in-pillow

The post AIM | M8 Solder Paste appeared first on ASI Technologies.

AIM | J8 No Clean Jetting Solder Paste

zivit.drori — Wed, 30 May 2018 15:17:24 +0000

AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining jetted paste deposits with printed paste deposits is required. J8 has a novel activator system providing powerful, durable wetting action accommodating a wide range of profiling producing bright shiny joints without graping defects. J8 has reduced voiding to as low as <5% on BGA and <10% on BTC ground pads.

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AIM | SN100 lead-free solder alloy

zivit.drori — Wed, 30 May 2018 15:12:35 +0000

Best choice for lead-free wave soldering

SN100 is a lead-free solder alloy is comprised of tin-copper-nickel + germanium. SN100 offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100 offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy.

The Bottom Line

Customer experience over several years is that the TOTAL cost of running a standard wave soldering machine with SN100 when all factors are taken into account can be up to one third the cost of running the same machine with tin-silver-copper alloys. The actual saving in each case will depend on the number of factors that apply, but the cost of running a line with SN100 is always lower than the cost of running the same line with tin-silver-copper.

Successfully tried and tested

Leading electronics manufacturers throughout the world have used SN100 with outstanding results. To date, millions of circuit boards have been assembled with the SN100 family of solders in all types of products. Many of the devices soldered with SN100 already have been in use for several years.

Seamless Changeover

AIM has already helped multitudes of manufacturers implement lead-free soldering, and we invite you to benefit from our expertise. Our services include process audits, solder pot analyses, and on-going applications support. The issue of lead-free soldering can be complex. We are here to help you from changeover right through to optimization.

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AIM | Sn63 Pb37 Electropure™ High Purity Alloy

zivit.drori — Wed, 30 May 2018 15:11:19 +0000

Sn63/Pb37 Electropure is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow, and reducing bridging during soldering. Sn63/Pb37 is a eutectic alloy with a melting point of 183°C. Typical applications are wave soldering and plating where Sn63/Pb37 is primarily used as a coating for corrosion protection, and as a base for soldering. This alloy is available in bar, solid and cored wire, foil, spheres, preforms, powder, solder paste, ingot, and anode form.

Features:

High Purity
Reduces Drossing
Exceeds IPC-J-STD-006 Specifications

The post AIM | Sn63 Pb37 Electropure™ High Purity Alloy appeared first on ASI Technologies.

AIM | SAC305 Lead-free Alloy

zivit.drori — Wed, 30 May 2018 15:09:39 +0000

SAC305 is a lead-free alloy that contains 96.5% tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared to other alloys and makes of bar, resulting in excellent flow. AIM’s SAC305 bar solder also produces less dross than other bar solder, wets well, provides superior joint strength, and offers superior copper dissolution rates. AIM’s SAC305 bar solder is alloyed in the proprietary Electropure method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow and reducing bridging during soldering. SAC305 may be used with most existing equipment, processes, coatings, and flux chemistries.

Features:

Lowest Cost Sn/Ag/Cu Alloy
Excellent Fatigue Resistance
Compatible with all Flux Types
Excellent Solder Joint Reliability
Best Wetting Sn/Ag/Cu Alloy

The post AIM | SAC305 Lead-free Alloy appeared first on ASI Technologies.

AIM | High Melting Point Solder Alloys

zivit.drori — Wed, 30 May 2018 15:08:02 +0000

High melting point solder alloys

Down hole electronics, such as oil and gas exploration, require solder alloys that have the durability to withstand the extreme thermal, geological and mechanical stresses of these applications. AIM understands system reliability is of the utmost importance, and offers a selection of high melting point solder alloys in a variety of forms which are proven to fulfill the requirements necessary for long-term reliability in solder joints.

The post AIM | High Melting Point Solder Alloys appeared first on ASI Technologies.

AIM | Additional Alloys

zivit.drori — Wed, 30 May 2018 15:05:34 +0000

AIM offers a broad range of alloys for SMT, wave soldering, hand soldering, and various applications. Commonly used alloys for the electronics industry are shown below. Other alloys are available upon request.

The post AIM | Additional Alloys appeared first on ASI Technologies.

AIM | No Clean Flux Pen

zivit.drori — Wed, 30 May 2018 15:00:41 +0000

AIM’s NC Flux Pen contains a low- to medium-solids, no-clean liquid flux formulated to aid soldering with flux cored wire solder. NC Flux offers an excellent activity level for use on ENIG, imsn, imag, bare copper, solder coated and OSP pcbs, leaving negligible post-process residues that are non-conductive and do not require post-process cleaning. NC Flux is safe to be left on the circuit board and passes IPC-004A and -004B SIR testing without thermal exposure.

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AIM | RMA 202-25 Medium Solids, Mildly Activated Liquid Flux

zivit.drori — Wed, 30 May 2018 14:57:37 +0000

RMA 202-25 is a medium solids, mildly activated liquid flux with a solvent rosin activation formulated to provide a post-process flux residue that is both insulating and non-hydroscopic and does not require cleaning. As a mildly activated rosin based flux, RMA 202-25 offers a wide process window, good cleaning properties, and excellent thermal transfer.

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AIM | NC280 Low-to-medium solids, no-clean Liquid Flux

zivit.drori — Wed, 30 May 2018 14:52:32 +0000

NC280 is a low-to-medium solids, no-clean liquid flux formulated to leave minimal post-process residues that are pin testable without cleaning. NC280 offers an excellent activity level with good performance on bare copper, solder coated and organic coated PWBs, leaving negligible post-process residues that are non-conductive and do not require post-process cleaning. NC280 is safe to be left on the circuit board and passes SIR in the raw state. NC280 is extremely safe for rework, palletized wave soldering and point-to-point selective soldering. NC280 has a unique chemistry and a wide process window, making it a drop-in for most no-clean and RMA wave soldering operations, including lead-free wave soldering.

The post AIM | NC280 Low-to-medium solids, no-clean Liquid Flux appeared first on ASI Technologies.

AIM | NC217 Gel Flux

zivit.drori — Wed, 30 May 2018 14:51:04 +0000

NC217 Gel Flux is designed for touch-up and repair work where the flux may spread away from the heat source. NC217 Gel Flux is electrically safe even without a thermal profile. This gel flux dries within one hour of use with or without heat and is tack-free after four hours.

The post AIM | NC217 Gel Flux appeared first on ASI Technologies.

AIM | NC paste flux

zivit.drori — Wed, 30 May 2018 14:49:29 +0000

NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA) packages.

The post AIM | NC paste flux appeared first on ASI Technologies.

AIM | FX16 No Clean Flux

zivit.drori — Wed, 30 May 2018 14:48:24 +0000

FX16 No Clean Flux has been engineered to provide exceptional soldering performance while leaving minimal, electrically safe flux residues, even when unheated. FX16 is ideally formulated for point-to-point selective soldering and palletized wave soldering. FX16 provides fast wetting and PTH barrel fill and reduces common soldering defects such as bridging, flagging and solder balls. FX16 has a durable activation system that can withstand high process temperature required for thermally demanding applications and extended solder contact time.

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AIM | Underfill FF35 One Component Epoxy Resin

zivit.drori — Wed, 30 May 2018 14:40:00 +0000

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underfill FF35 offers superior reliability through high Tg, low CTE, good fill, no voiding, compatibility with no-clean flux residues and excellent adhesion. Faster throughput and higher yields are achieved through excellent capillary action, faster flow characteristics and rapid cure speeds. Underfill FF35 may be reworked at 120°C (250°F). The viscosity of Underfill FF35 remains stable throughout its shelf life. This product is suitable for bare chip protection in a broad variety of small die applications.

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AIM | One Step Underfill 688 One Component Epoxy Resin

zivit.drori — Wed, 30 May 2018 14:34:27 +0000

One-Step Underfill 688 is a low surface tension, one component epoxy resin designed as a one-step no-flow underfill for flip chip, CSP, BGA and micro-BGA assemblies. One-Step Underfill 688 improves product reliability through high Tg, low CTE, and good fill with no voiding. Even though One-Step Underfill 688 does not require flux, it is compatible with no-clean flux residues and provides excellent adhesion. One-Step Underfill 688 can be dispensed directly following solder paste printing, after which components are placed and the entire assembly is reflowed and cured simultaneously in a standard lead-free reflow process. This eliminates the need for a second assembly process and separate cure cycle. The result of this is faster throughput and higher yields that are achieved in one step through excellent capillary action, fast reflow characteristics, and rapid cure speeds. One-Step Underfill 688 may be reworked at 120° C and the viscosity of the product remains stable through out its shelf life. This product wets solder to OSP, ENIG, immersion silver, and immersion tin board surfaces.

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