The patented interchangeable hardened steel guide allows safe positioning and smooth board feeding during cutting. Its unique geometry protects the assembled PCB even in case of incorrect operator insertion, ensuring compliance with safety standards.

Key Features

• Precision milling system with spindle speed up to 24,000 rpm
• Patented hardened and tempered steel interchangeable guide with built-in circuit protection
• Clean cutting without PCB fiber tearing
• Integrated aspiration system with BIA-certified polyester cartridge filter
• HEPA H14 filter available upon request
• Laminated ESD-safe worktop
• Adjustable working height: 900 / 1000 / 1100 mm
• Suitable for straight and circular boards

The post Manual PCB Depaneling System with Milling Cutter | Piergiacomi DPF300 EVO appeared first on ASI Technologies.

Typical Applications:

• Fluorescent inspection: Detecting cracks, defects, and surface inconsistencies.
• PCB cleanliness testing: Revealing flux residues and contaminants on printed circuit boards.
• Component authenticity: Verifying genuine parts through UV-sensitive markings.
• Fluorescent Penetrant Inspection (FPI): Locating surface/subsurface flaws in metals and composites.

Rework under UV: Safe repair of critical assemblies under UV illumination.

The post UV BOOTH – UV Inspection & Rework Station | GEN3 appeared first on ASI Technologies.

In a world where raw material costs are rising especially the price of silver-there’s no reason to keep using SAC305 when a more reliable, stronger, and more cost-effective alternative exists.

We are proud to launch in Israel REL61,
AIM Solder’s innovative lead-free solder alloy, fully synergized with proven M8 flux chemistry, delivering one clear result: higher reliability at a lower cost.

The simplest transition – a true Drop-In Solution

No need to change the “recipe” that already works for you. Switching to REL61 is seamless:

• Same chemistry: The proven M8 flux remains unchanged.
• Same reflow profile: A lower melting range (208°C–215°C) enables use of existing profiles with minimal risk.
• Full process stability: The same print stability and long stencil life you already know from M8.

Market-leading reliability – not just meeting the standard

• Thermal cycling performance: Comparable to SAC305 from -40°C to +125°C.
• Drop shock resistance: About 25% improvement SAC305 in Drop Shock testing, thanks to a refined grain structure.
• Low voiding: Exceptionally low void levels in QFN and BGA components-well below IPC requirements.

Direct, measurable savings – over 30% in paste cost

• Immediate ROI: Reduced silver content delivers significant, direct savings on paste purchasing-without technological compromise.
• Component protection: Lower process temperatures help protect sensitive components and reduce warpage on thin boards.
• Inspection efficiency: Smooth, shiny solder joints support AOI performance and reduce false calls.

Switching to REL61 on the M8 platform enables you to lower BOM costs while improving your product’s mechanical reliability.

The post M8-REL61 Solder Paste | AIM Solder appeared first on ASI Technologies.

The TMT‑ST10 is a compact, multi-functional tester designed to ensure soldering iron tip performance meets the highest standards. It integrates three essential testing capabilities into one portable unit: tip temperature, tip‑to‑ground resistance, and tip‑to‑ground AC voltage leakage. Ideal for production lines, QA laboratories, and service environments.

Key Features

• Three functions in one device:
  • Tip Temperature (°C/°F switchable)
  • Tip‑to‑Ground Resistance (Ω)
  • Tip‑to‑Ground AC Voltage Leakage (mV)
• Real-time measurement with clear LCD display
• Internal memory for up to 32,640 test events
• Mini USB port for data export and analysis
• Includes: 10× K‑type thermocouple sensors, Mini USB cable, and ground wire
• RoHS compliant and CE certified

The post Thermaltronics TMT ST10 – 3 in 1 Soldering Tip Tester appeared first on ASI Technologies.

The PDR IR-E6 is the ultimate platform for extra-large PCBs used in aerospace, automotive, and defense industries. It combines a gantry-mounted IR head with powerful preheating for the most demanding thermal requirements.

Key Features:

• XL PCB Capacity: Designed for boards up to 460 × 620 mm (18″ × 24″).
• Gantry-Mounted Top Heater: 150W Focused IR head for easy positioning across large surfaces.
• High-Power Preheating: 4000W 3-zone Dark IR preheater for high-mass components.
• Dual-Camera Alignment: Split Beam Prism system with Gig-E cameras for flawless alignment.
• Advanced Thermal Control: Supports layered profiles and real-time reflow observation.

The post PDR IR-E6 Evolution – High-End XL Rework Platform appeared first on ASI Technologies.

The PDR IR-E3 is a cost-effective, high-yield rework solution. It features Focused IR heating and Closed-Loop thermal control, making it ideal for laboratories, field repairs, and small-batch production.

Key Features:

• Contact-Free IR Heating: Precise thermal delivery to SMD and BGA components without collateral damage.
• Closed-Loop Thermal Control: Dual non-contact IR sensors for the component and PCB.
• ThermoActive Software: Simplifies the rework process with repeatable thermal profiles.
• Versatile PCB Capacity: Supports boards up to 300 × 450 mm.
• Tool-Free Operation: Gas-free and nozzle-free technology for a clean, complication-free process.

The post PDR IR-E3 – Entry-Level IR Rework Station appeared first on ASI Technologies.

The IR-Q3 system from PDR is engineered for professional rework of SMD, BGA, CSP, QFN, LED, and RoHS components. Utilizing Focused Infrared heating technology, the system provides a smart, intuitive experience with a proven 98% yield in BGA repairs.

Key Features:

• Focused IR Top Heater: 150W precise, contactless heating with adjustable spot sizes.
• 3-Zone Quartz PCB Preheater: 3250W Dark IR system for fast and even heating.
• Split Beam Optical Alignment: Provides simultaneous viewing of PCB and component for accuracy up to 5µm.
• Closed-Loop Thermal Control: Non-contact IR sensors monitor both the component and PCB in real-time.
• ThermoActive Software Suite: Advanced thermal profiling and automatic process control.
• Reflow Process Observation: High-resolution camera for real-time visual monitoring.
• Pick & Place Mechanism: Automatic component removal and placement with “soft landing” capability.
• Modular Design: Fully upgradeable platform to meet changing production needs.
• 2-Year Warranty: Comprehensive manufacturer support.

The post PDR IR-Q3 – Semi Automatic Assisted Rework appeared first on ASI Technologies.

• Exceptional 4K Clarity Up to 5x more accurate measurements than standard HD systems
• Zero Video Latency (60fps) Lag-free live imaging for precise hand-eye coordination during rework and assembly
• Factory-Calibrated Precision Certified accuracy at every magnification with no recalibration needed
• Standalone Performance Plug & play system that works without a PC or drivers
• Compliance-Ready Built-in image capture with timestamping for full traceability
• Software Apps 2D Measurement, Image Stacking, DXF Overlay, and Real-Time Lens Distortion Correction.

The post ASH Omni Vantage | 4k Ultra HD Digital Microscope appeared first on ASI Technologies.

Key Features:

• Internal volume: 225 liters
• Temperature range: -70°C to +180°C
• Humidity range: 0% to 100% RH
• Temperature fluctuation: ±0.5°C
• Uniformity: ≤2.0°C
• Color touchscreen controller
• Heated observation window
• SUS304 stainless steel chamber
• Hermetic compressor cooling system
• Quiet fans for even airflow
• Built-in safety: over-temp, compressor & motor overload, leakage protection

Dimensions:
869×1925×1345 mm (external) | 600×750×500 mm (internal)
Power Supply: AC 380V, 50Hz (3 Phase)
Ambient Temp: +5°C to +35°C

The post Temperature & Humidity Test Chamber (225L) | ASI TC-225 appeared first on ASI Technologies.

Key Features:

• Internal volume: 64 liters
• Temperature range: -70°C to +180°C
• Humidity range: 0% to 100% RH
• Temperature fluctuation: ±0.5°C
• Temperature uniformity: ≤2.0°C
• Heating rate: 3.0°C to 5.0°C/min (no load)
• Cooling rate:
  • 2.0–3.0°C/min (from +180°C to +25°C)
  • 1.0–2.0°C/min (from +25°C to -70°C)
• Touchscreen controller with programmable/fixed modes
• Multi-layer heated observation window (anti-condensation)
• SUS304 stainless steel interior
• Hermetic compressor refrigeration
• Integrated humidity control
• Low-noise centrifugal fans
• USB data export
• Built-in protections: over-temperature, compressor overload, leakage breakers

Dimensions:

600×1340×965 mm (external) | 400×400×400 mm (internal)
Power: AC 220V, 50Hz
Operating ambient temperature: +5°C to +35°C

The post Temperature & Humidity Test Chamber (64L) | ASI TC 64 appeared first on ASI Technologies.

Why Choose Atlas Dry?

• Ultra-fast dehumidification: from 50% to <1% RH in 12 minutes (6 min with dual dryer).
• Extreme precision: stable humidity down to 0.5% RH with ±0.3% sensors.
• Flexible capacity: from 316L to 1913L – 1 to 4 doors.
• Smart control: 7″ touchscreen, WiFi / Ethernet / Modbus, historical data logs, built-in alarms.
• Zero maintenance: quiet operation, anti-static build, no consumables required.
• Optional heating/cooling: up to 130°C heating / down to 5°C cooling.
• Remote monitoring & Industry 4.0 ready
• Secure access: password locks, RFID, user permission management.
• Tailored accessories: sliding shelves, SMD reel holders, feeders, HEPA filter, and more.

Available Models:

• ADC-300 / ADC-700 / ADC-900 / ADC-1400 / ADC-1900
• Volume: 316–1913 L | Shelves: 2–10 | Avg. power: 50 W/h
• Shelf load: up to 60 kg | Max. load: 450 kg
• Structure: conductive steel (ESD safe)

The post Ultra-Fast Drying Cabinets for Moisture-Sensitive Devices | ATLAS appeared first on ASI Technologies.

Specifications

• Strong solvency power (KB Value: 83)

• Azeotropic formulation – consistent performance in vapor cycles

• Non-flammable, Low GWP (47), ODP = 0

• Broad compatibility with plastics, metals, elastomers

• Ideal for vapor degreasing, immersion cleaning, and carrier applications

Effective for lubricant deposition applications where increased solvency is desired

The post ASI-73DE heavy-duty Vapor Degreaser appeared first on ASI Technologies.

Key Features & Advantages:

• Non-flammable, colorless, low odor

• ODP = 0, GWP = 55

• Excellent material compatibility

• Mild solvency for flux and oil removal

• Ideal for vapor degreasing, immersion cooling, and as a carrier solvent

The post ASI 7200 – Fluorinated Fluid appeared first on ASI Technologies.

With its compact design and intelligent temperature control, it ensures consistent soldering quality while maintaining energy efficiency.

Key Features

• 8 Heating Zones: 4 top and 4 bottom zones provide uniform temperature distribution for reliable soldering.
• Intelligent Temperature Control: High-sensitivity sensors maintain stable temperatures with minimal deviation.
• Energy Efficient: Low power consumption with a working power of approximately 1.5 kW.
• Built-in Smoke Filtration: Integrated system effectively filters harmful gases, promoting a safer working environment.
• Compact Design: Space-saving footprint suitable for various production settings.
• User-Friendly Interface: Simplified controls for easy operation and maintenance.

Applications

• SMT Production Lines: Ensures consistent soldering quality for various PCB assemblies.
• Prototyping: Suitable for small-batch production and testing.
• Educational Institutions: Perfect for training and research purposes.

The post Neoden | IN8C REFLOW OVEN appeared first on ASI Technologies.

Key Features

• Full convection heating ensures uniform soldering with excellent results.
• Stores up to 16 user profiles, with easy switching between Celsius and Fahrenheit.
• High-sensitivity temperature sensor keeps stability within ±0.2 °C.
• Integrated smoke filtering system — eco-friendly and clean.
• Uses aluminum alloy heating plates for energy efficiency and stable heat (±2 °C deviation).
• Advanced insulation design keeps exterior casing below 40 °C.
• Includes ESD-safe tray for easy PCB handling post-reflow.
• Compact yet powerful with 6 heating zones.
• Real-time temperature curve display for monitoring soldering profiles.
• TÜV NORD CE certified for quality and safety.

The post REFLOW OVEN IN6 | NEODEN appeared first on ASI Technologies.

PVA’s atmospheric plasma systems deliver high-performance point or rotary plasma to remove organic contaminants and significantly increase surface energy. This ensures superior adhesion of adhesives, underfills, die bonds, and coatings, while improving product reliability and yield. Plasma treatment has become a standard in critical electronics, automotive, and medical applications, including flip-chip and wafer processing.

Key Benefits

• Enhances adhesion for coatings, underfills, die & wire bonds
• Cleans micro-contaminants from PCBs, substrates, wafers, and carriers
• Supports inline & robotic integration (SMEMA/PLC compliant)
• CFR 21 Part 11-ready with audit-trail and recipe logging
• Modular: point, rotary, or inline configurations
• Calibrated gas mix, power, and process time for each specific application

Typical Applications

• SMT boards, substrates & components
• Optical & conformal coating preparation
• Medical & aerospace electronics
• Automotive die bond & wire bond enhancement
• Flip-Chip underfill: improves wetting, capillary flow, and yields

Note: Maximum effectiveness requires precise calibration of gas composition, power, and exposure time for each application. PVA offers full support in process development, calibration, and integration to ensure optimal performance.

The post Atmospheric Plasma Surface Treatment System | PVA appeared first on ASI Technologies.

It handles PCBs up to 1200 × 610 mm and can be configured with single or dual solder baths, allowing simultaneous processing of multiple boards or nozzle configurations, enhancing flexibility and throughput.

The standard solder module features an onboard Drop-Jet fluxer, with optional infrared or convection pre-heating (top and bottom) controlled by closed-loop pyrometer. Modules can be dedicated specifically for fluxing or pre-heating to further streamline production.

Compatible with all Pillarhouse soldering technologies, including patented 1.5 mm Micro Nozzle, Jet Wave, AP-1, and custom multi-dip. Rapid, non-contact solder pot exchange is facilitated by an optional heated pot trolley.

The Synchrodex Pro operates with PillarCOMM.NET software, a Windows®-based “Point & Click” interface supporting offline programming using Gerber data, ensuring quick setup, precise control, and seamless Industry 4.0 integration.

The post Orissa Synchrodex Pro Advanced Inline Selective Soldering System | Pillarhouse appeared first on ASI Technologies.

3M Fluorinert FC‑3283

With zero ozone depletion, significantly lower global warming potential, and recyclability via distillation, ASI-3283S offers a future-proof solution for OEMs and integrators transitioning from legacy PFCs.

Key Features & Benefits

• Functionally equivalent to FC‑3283 – ready for immediate use
• Non-flammable and safe – no flash point
• High dielectric strength (>40 kV)
• Operational stability from −65°C to +130°C
• Recyclable and reusable via closed-loop distillation
• Ultra-low surface tension (14.6 mN/m) for effective micro-cooling
• Environmentally responsible: ODP = 0, low GWP

Applications

• Semiconductor thermal management – test & burn-in systems
• Thermal shock & cycling – automotive, aerospace, defense testing
• High-voltage insulation – converters, sensors, transformers
• Precision cleaning – removal of particulate and ionic contaminants

The post ASI-3283 – Drop-in Replacement for 3M™ Fluorinert™ FC-3283 appeared first on ASI Technologies.

Designed for manufacturers seeking a safe, residue-free solution with full process compatibility and alignment with international environmental standards.

Key Features & Advantages

• Drop-in replacement for Novec 71IPA
• Non-flammable, thermally stable formula
• Zero ODP, GWP < 310 – meets global regulatory requirements
• Low surface tension (14.5 mN/m) – ensures penetration into fine structures
• Fast evaporation, no residue
• Compatible with metals, plastics, optics, and electronics

Typical Applications

• Vapor degreasing of PCBs and electronic assemblies
• Flux removal (including “no-clean” residues)
• Pre-conformal coating cleaning
• Cleaning of lenses, sensors, and precision optics

The post Precision Cleaning Fluid & Novec™ 71IPA Replacement | ASI 71IPA appeared first on ASI Technologies.

With an extended operating temperature range (−105°C to +50°C) and extremely low surface tension (14.15 mN/m), ASI-7100 is designed for demanding applications in precision cleaning, display coatings, and semiconductor manufacturing.

Key Features & Advantages:

• Direct Novec 7100 alternative – tested for drop-in use
• Non-flammable, colorless, low-odor fluid
• Excellent electrical insulation: dielectric strength ≥41.9 kV, constant 8.2 @ 1 MHz
• Low viscosity (0.487 mm²/s) for efficient flow and sprayability
• High thermal stability and chemical resistance
• Leaves no residue, safe for sensitive microstructures
• Environmentally sound: ODP = 0, GWP = 320

Applications

• Precision cleaning of semiconductor components and optics
• Heat transfer fluid in wafer testing, burn-in systems, and assemblies
• Solvent carrier for anti-fingerprint or display coating systems
• Wetting agent in specialty chemical formulations

The post ASI 7100 – Fluorinated Fluid Replacement for 3M™ Novec™ 7100 appeared first on ASI Technologies.

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This is specifically useful for contract manufacturers, who receiving the data from various sources and losing hours and hours on adjusting this data to a common format.

SMT Assistant allows within few minutes add the packages or/and the part numbers from BOM to existing CAD, separate data for different PCB sides, standardize the package name according to ALeader Public library and more.

The post SMT Programmer Assistant application | ALeader appeared first on ASI Technologies.

To avoid such failures and also to save cost on expensive repair more efforts today directed on production process improvement and defect prevention.

ALeader AOI systems support such efforts with its proprietary ALDSPC application. The software is included into a standard configuration on the system (offline installation is the option) and includes various charts and analysis, easy and fast report generation.

The post SPC – Software Process Control appeared first on ASI Technologies.

• Creation of new program while line is running.
• Program adjustments without disrupting the production process.
• Offline programming station connected to the same library and the programs as the systems in the production.
• Ability to support multiple lines using only one offline station.

The post Offline programming station | ALeader appeared first on ASI Technologies.

The post JM-50 THT and SMT Pick & Place Machine | JUKI appeared first on ASI Technologies.

The post JM-100 THT Pick & Place Machine | JUKI appeared first on ASI Technologies.

Two high-speed placement heads, each with 20 suction cups, ensure unprecedented productivity over a line length of less than one meter.

The post RX-8 Highspeed Pick & Place Machine | JUKI appeared first on ASI Technologies.

The post RS-1XL Placement Machine – smart, fast, modular | JUKI appeared first on ASI Technologies.