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REBALLER MINIOVEN 05

ה MINIOVEN 05 תנור קטן וקומפקטי המיועד לסביבת הפיתוח והייצור.

• ה MINIOVEN 05 מכשיר שולחני קומפקטי ויעיל שמיועד בעיקר לתהליכי שיחזור רכיבי BGA והכנת רכיבי QFN להלחמה ידנית .
• בזכות טכנולוגיית החימום ההיברידית שלו האפקט שמתקבל זהה לתנורים גדולים סטנדרטיים.
• החימום שמתבצע בצורה עדינה וסימולטנית מכל הצדדים מבטיח תהליך איכותי בעל תוצאות גבוהות.
• התצוגה הגדולה וארבעת הכפתורים בפאנל הקדמי מאפשרים בניית סט-אפ מהיר ושליטה בעד 25 תוכניות ופרופילים שניתן לשמור בתוך המכשיר.
• ניתן לבנות פרופילים באמצעות הפרופיילר האוטומטי בתוך המכשיר.
• ה MINIOVEN 05 יכול להשתמש בחיישן טמפרטורה חיצוני נוסף המתחבר למכשיר ומודבק צמוד לרכיב בתנור ומציג את הטמפרטורה המדויקת על הרכיב עצמו.
• ניתן להוסיף שימוש בגז כמו חנקן.
• תוכנת ה EASYBEAM כלולה במכשיר ומאפשרת בניה ושמירה של פרופילים מתוך שרת החברה ללא תלות במכשיר.
• החיבור הפשוט של USB מהמכשיר למחשב מאפשר שליטה בין שני חיישני הטמפרטורה ויצירת אופטימזציה של הפרופיל בהתאם לדרישות המשתמש ובצורה מושלמת.
• קיים מלאי גדול של אביזרים נלווים הכוללים בין היתר מגוון רחב של סטנסילים עבור סוגים רבים של רכיבי BGA ו QFN.

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The atomized spray process resulting from the FCS300-ES will produce excellent edge definition and coating transfer efficiencies in excess of 99%. The FCS300-ES features a micrometer flow adjustment that makes fine tuning of your process easier than ever.

The post PVA | FCS300-ES Selective Conformal Coating / Valves appeared first on ASI Technologies.

The FCM100 “propels” precise shots of fluid onto a substrate resulting in accurate patterns at a high robot speed as no in process z-axis adjustments are required. The FCM100 is compatible with all PVA automated platforms.

The post PVA | FCM100 Selective Conformal Coating / Valves appeared first on ASI Technologies.

Each component is metered via a servo controlled rotor that seals a rubberized stator to produce a continuous flow of material.  Tight tolerance on the sealing mechanism assures pulse-free and drip-free operation, even with low viscosity fluids.  As each component is metered in separate chambers, no routine flushing or purging is necessary as the chemistry will not crystallize in the fluid body.

The A and B components are introduced via a disposable static mixer in the air cap to produce a fine conical shaped pattern.

The post PVA | VPX-2KS Meter Mix / Valves appeared first on ASI Technologies.

The atomized spray process resulting from the FCS300 will produce conical (round cap) or fan-shaped (flat cap) patterns with transfer efficiencies in excess of 99%. The FCS300 features a micrometer flow adjustment that makes fine tuning of your process easier than ever.

The post PVA | FCS300 Selective Conformal Coating / Valves appeared first on ASI Technologies.

The Delta 6 features a robust overhead three-axis motion platform suitable for inline or batch operations.

While maintaining the preferred features of previous workcells, the Delta 6 has been designed with a slimmer footprint, improved structural and gantry rigidity for robustness, and easier access.

The post PVA | DELTA 6 Fluid Dispensing & Automation appeared first on ASI Technologies.

Compact Reflow-Mini oven for the desktop

Compact BGA Reballer for tasks in R&D and production. Employs hybrid heating technology for best temperature homogenity and supports the use of two temperature sensors. Auto-profiling and PC Tools and included.

The MINIOVEN 05 is a compact and robust table-top device specially designed for re-balling of BGAs and pre-bumping of QFN components. Its highly efficient hybrid heating technology heats-up the electronic components like in a standard reflow oven: Gently and simultaneously from all sides and guarantees repeatable process results with high yield.  MINIOVEN 05 is perfect for use in both production and R&D environments.

The large display and the 4 button front panel layout enable fast set-up and administration of up to 25 re-balling profiles which can be saved in the device. Profiles can be taught with the device’s auto profiler software. The MINIOVEN 05 uses readings from a second temperature sensor which is connected to the oven and attached next to the BGA to measure the IC temperature. Aninput for thr use of process gasses (such as nitrogen) is factory set.

The PC software EASYBEAM is included and can be used to download profiles, i.e. for easy back-up and upload of re-balling profiles i.e. from a production server. EASYBEAM V2 connects via USB to the MINIOVEN 05 and can also display temperature plots of the two sensors and allows optimization of profile parameters to fit user expectations perfectly.

In addition to a wide range of tooling and accessories for BGA re-balling, holders, fixtures and stencils for QFN pre-bumping are available too.

The post Martin | Reballer MINIOVEN 05 appeared first on ASI Technologies.

Compact Reflow-Mini oven for the desktop

Compact BGA Reballer for tasks in R&D and production. Employs hybrid heating technology for best temperature homogenity and supports the use of two temperature sensors. Auto-profiling and PC Tools and included.

The MINIOVEN 05 is a compact and robust table-top device specially designed for re-balling of BGAs and pre-bumping of QFN components. Its highly efficient hybrid heating technology heats-up the electronic components like in a standard reflow oven: Gently and simultaneously from all sides and guarantees repeatable process results with high yield.  MINIOVEN 05 is perfect for use in both production and R&D environments.

The large display and the 4 button front panel layout enable fast set-up and administration of up to 25 re-balling profiles which can be saved in the device. Profiles can be taught with the device’s auto profiler software. The MINIOVEN 05 uses readings from a second temperature sensor which is connected to the oven and attached next to the BGA to measure the IC temperature. Aninput for thr use of process gasses (such as nitrogen) is factory set.

The PC software EASYBEAM is included and can be used to download profiles, i.e. for easy back-up and upload of re-balling profiles i.e. from a production server. EASYBEAM V2 connects via USB to the MINIOVEN 05 and can also display temperature plots of the two sensors and allows optimization of profile parameters to fit user expectations perfectly.

In addition to a wide range of tooling and accessories for BGA re-balling, holders, fixtures and stencils for QFN pre-bumping are available too.

The post Martin | Reballer MINIOVEN 05 appeared first on ASI Technologies.

The SMART DESOLDER combines a manual hot gas source with a vacuum pen for extraction of residual solder. Damage to the pads from overheating or mechanical stress is avoided through targeted heating of the residual solder after lifting the component. The temperature-controlled airflow prevents the neighboring components from warming up. After melting, the residual solder is removed contactless by the vacuum pen. The use of a Teflon tip in the vacuum pen offers outstanding features: the nonstick effect, the temperature-resistance and the mechanically soft surface of the material. As a stand-alone device, it virtually fits on any work bench and can be operated very flexible with two handheld pens.

The post Martin | Smart Desolder 01 appeared first on ASI Technologies.

The new Protecto coating system was developed to satisfy your demands for highest quality, stability and productivity for automatic in-line coating tasks.

Particular emphasis is placed on maintainability, intuitive program configuration and ultra-flexible equipment that can be adapted to customer requirements.

The patented Stream-Coat® nozzles measuring up to 100 mm long and only 2.4 mm thick enable a protective coating between tightly packed, tall components. This means expensive and time-consuming manual re-coating is a thing of the past.

Furthermore, different application methods such as dispensing, spraying or jetting can be achieved “on the fly”, without changing the applicator and without splatters. Even areas under components can be coated using the connectible manifold cut-out on the Stream Coat® nozzles. The manifold cut-out does this by pushing the coating material under the component. Up to four different, selective coating tasks can be performed effortlessly with up to four coating applicators in multiple applications.

Features:

• Multifunctional coating application: jetting, dispensing and spraying
• Greatest possible process reliability
• Up to 4 heatable nozzles
• Highest coating accuracy
• All-in-one lacquering
• Selective coating
• Long-lasting fault-free lacquering
• Minimal maintenance required
• Also available as a production line concept consisting of a Protecto dispenser and RDS lacquer dryer
• Quick, intuitive programming with dependable software tools
• Flexible lacquering options thanks to multifunctional lacquer applicator

The post Rehm | Protecto XP Selective Conformal Coating Systems appeared first on ASI Technologies.

The upper surface of a plant’s leaves is its outermost defence, not only protecting it against pests and water loss, but also helping shake off dirt or increase resistance. This is a particularly well-known characteristic of the lotus flower – water just drips right off it. This was the biological inspiration behind innovative, self-cleaning surface coatings with what is known as the “lotus effect”.

The protective lacquer coating on electronic units acts in a similar way. It is now absolutely essential to protect sensitive components from aggressive environmental influences such as moisture, corrosion, chemicals, dust or vibration. High-selectivity conformal coating is the key to ensuring electronics work reliably and is indispensable in modern manufacturing.

Rehm has expanded its product range, introducing a compact, high-performance coating system to the market in ProtectoXC. Its low investment costs make it particularly appealing to electronics manufacturers who process low throughput. The device combines precise coating with a focus on what matters most: perfect protection for your electronics.

Features:

• Reliable coating process, even for low throughput
• Compact unit, easily integrated with batch or line production
• Modern software with touch operation and 3D trackball
• Barcode connectivity and optimum process documentation
• Low investment costs, top process performance
• Easy to maintain with its smart cleaning system

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