Solder paste - ASI Technologies

M8-REL61 Solder Paste | AIM Solder

KEREN MANY A2Z — Wed, 11 Feb 2026 14:56:59 +0000

The winning combination for smart, cost-effective electronics manufacturing

In a world where raw material costs are rising especially the price of silver-there’s no reason to keep using SAC305 when a more reliable, stronger, and more cost-effective alternative exists.

We are proud to launch in Israel REL61,
AIM Solder’s innovative lead-free solder alloy, fully synergized with proven M8 flux chemistry, delivering one clear result: higher reliability at a lower cost.

The simplest transition – a true Drop-In Solution

No need to change the “recipe” that already works for you. Switching to REL61 is seamless:

Same chemistry: The proven M8 flux remains unchanged.
Same reflow profile: A lower melting range (208°C–215°C) enables use of existing profiles with minimal risk.
Full process stability: The same print stability and long stencil life you already know from M8.

Market-leading reliability – not just meeting the standard

Thermal cycling performance: Comparable to SAC305 from -40°C to +125°C.
Drop shock resistance: About 25% improvement SAC305 in Drop Shock testing, thanks to a refined grain structure.
Low voiding: Exceptionally low void levels in QFN and BGA components-well below IPC requirements.

Direct, measurable savings – over 30% in paste cost

Immediate ROI: Reduced silver content delivers significant, direct savings on paste purchasing-without technological compromise.
Component protection: Lower process temperatures help protect sensitive components and reduce warpage on thin boards.
Inspection efficiency: Smooth, shiny solder joints support AOI performance and reduce false calls.

Switching to REL61 on the M8 platform enables you to lower BOM costs while improving your product’s mechanical reliability.

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AIM Solder | NC257MD Jet Printing Solder Paste

ASI Specialist — Mon, 12 Sep 2022 10:14:19 +0000

Features:

– Specially Engineered for Mycronic Jet Printers

– Clear Pin-Probe Testable Residue

– Excellent Wetting, Even Leadless Devices

– Reduces Voiding Under Micro-BGAs

– 8-12 Hour Tack Time

– Vapor Phase Compatible

– For Use With Mycronic AG Type Ejector

NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC257MD prolongs ejector life and reduces paste scrap and consumption. The superior wetting ability of NC257MD results in bright, smooth and shiny solder joints and reduced voiding on BGA and BTC devices. NC257MD produces low post reflow flux residues, which remain crystal clear and easily probed even at the elevated temperatures required for lead-free alloys.

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AIM | V9 NO CLEAN SOLDER PASTE

ASI Specialist — Sun, 10 Jul 2022 13:38:47 +0000

Low Voiding: as low as 1% on BGA and <5% on BTCs
Capable of Consistent Printing with Area Ratio <0.66
High Reliability (SIR)
Drop-in for M8
REACH and RoHS* Compliant
Available in SAC305 T4
DESCRIPTION
V9 No Clean solder paste is formulated for near-zero voiding on
BGA, BTC and LED soldering applications. Significant void
reduction achievable on all surface finishes including ENIG, ImSn
and OSP. V9 exhibits stable print performance on fine feature

devices over 12 hours. V9 post-process residue is easily pin-
probed and has high SIR values.

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AIM | NC273 LT Solder Paste

zivit.drori — Wed, 30 May 2018 15:20:08 +0000

The revolutionary activator system in AIM’s new NC273LT low temperature solder paste improves the wetting performance of bismuth alloys to RoHS compliant plating and surface finishes, while ensuring long stencil life, excellent transfer efficiencies and minimizes solder balling common to high bismuth materials. The majority of lead-free solutions require higher processing temperatures than their lead bearing predecessors. In some cases, these higher temperatures cannot be tolerated by other materials in the assembly. When thermal exposure during the assembly process is a limitation, NC273LT solder paste for bismuth bearing alloys is an excellent RoHS compliant replacement. Bismuth bearing solder pastes can reduce peak reflow temperature requirements to as low as 170°C – 175°C (340°F – 350°F). AIM’s NC273LT solder paste formula with bismuth containing alloys can provide an assembler with an innovative solution when temperature sensitivity is paramount.

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AIM | M8 Solder Paste

zivit.drori — Wed, 30 May 2018 15:18:54 +0000

M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGA and reduced voiding on QFN/BTC components while producing bright shiny solder joints. M8 leaves minimal, high purity, residue, engineered to be safely left in place. Developed with the input of coating and cleaning industry partners, residues can be directly coated or easily removed.

Features:

Halogen-free
Low voiding on BGA and BTC components
REACH and RoHS compliant
For use with demanding, high density electronic assemblies
High SIR/Electrically safe residue
Formulated for use with T4 and finer powders
Mitigates head-in-pillow

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AIM | J8 No Clean Jetting Solder Paste

zivit.drori — Wed, 30 May 2018 15:17:24 +0000

AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining jetted paste deposits with printed paste deposits is required. J8 has a novel activator system providing powerful, durable wetting action accommodating a wide range of profiling producing bright shiny joints without graping defects. J8 has reduced voiding to as low as <5% on BGA and <10% on BTC ground pads.

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