Solder bar - ASI Technologies

AIM | SN100 lead-free solder alloy

zivit.drori — Wed, 30 May 2018 15:12:35 +0000

Best choice for lead-free wave soldering

SN100 is a lead-free solder alloy is comprised of tin-copper-nickel + germanium. SN100 offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100 offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy.

The Bottom Line

Customer experience over several years is that the TOTAL cost of running a standard wave soldering machine with SN100 when all factors are taken into account can be up to one third the cost of running the same machine with tin-silver-copper alloys. The actual saving in each case will depend on the number of factors that apply, but the cost of running a line with SN100 is always lower than the cost of running the same line with tin-silver-copper.

Successfully tried and tested

Leading electronics manufacturers throughout the world have used SN100 with outstanding results. To date, millions of circuit boards have been assembled with the SN100 family of solders in all types of products. Many of the devices soldered with SN100 already have been in use for several years.

Seamless Changeover

AIM has already helped multitudes of manufacturers implement lead-free soldering, and we invite you to benefit from our expertise. Our services include process audits, solder pot analyses, and on-going applications support. The issue of lead-free soldering can be complex. We are here to help you from changeover right through to optimization.

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AIM | Sn63 Pb37 Electropure™ High Purity Alloy

zivit.drori — Wed, 30 May 2018 15:11:19 +0000

Sn63/Pb37 Electropure is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow, and reducing bridging during soldering. Sn63/Pb37 is a eutectic alloy with a melting point of 183°C. Typical applications are wave soldering and plating where Sn63/Pb37 is primarily used as a coating for corrosion protection, and as a base for soldering. This alloy is available in bar, solid and cored wire, foil, spheres, preforms, powder, solder paste, ingot, and anode form.

Features:

High Purity
Reduces Drossing
Exceeds IPC-J-STD-006 Specifications

The post AIM | Sn63 Pb37 Electropure™ High Purity Alloy appeared first on ASI Technologies.

AIM | SAC305 Lead-free Alloy

zivit.drori — Wed, 30 May 2018 15:09:39 +0000

SAC305 is a lead-free alloy that contains 96.5% tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared to other alloys and makes of bar, resulting in excellent flow. AIM’s SAC305 bar solder also produces less dross than other bar solder, wets well, provides superior joint strength, and offers superior copper dissolution rates. AIM’s SAC305 bar solder is alloyed in the proprietary Electropure method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow and reducing bridging during soldering. SAC305 may be used with most existing equipment, processes, coatings, and flux chemistries.

Features:

Lowest Cost Sn/Ag/Cu Alloy
Excellent Fatigue Resistance
Compatible with all Flux Types
Excellent Solder Joint Reliability
Best Wetting Sn/Ag/Cu Alloy

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AIM | High Melting Point Solder Alloys

zivit.drori — Wed, 30 May 2018 15:08:02 +0000

High melting point solder alloys

Down hole electronics, such as oil and gas exploration, require solder alloys that have the durability to withstand the extreme thermal, geological and mechanical stresses of these applications. AIM understands system reliability is of the utmost importance, and offers a selection of high melting point solder alloys in a variety of forms which are proven to fulfill the requirements necessary for long-term reliability in solder joints.

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