Designed for manufacturers seeking a safe, residue-free solution with full process compatibility and alignment with international environmental standards.

Key Features & Advantages

• Drop-in replacement for Novec 71IPA
• Non-flammable, thermally stable formula
• Zero ODP, GWP < 310 – meets global regulatory requirements
• Low surface tension (14.5 mN/m) – ensures penetration into fine structures
• Fast evaporation, no residue
• Compatible with metals, plastics, optics, and electronics

Typical Applications

• Vapor degreasing of PCBs and electronic assemblies
• Flux removal (including “no-clean” residues)
• Pre-conformal coating cleaning
• Cleaning of lenses, sensors, and precision optics

The post Precision Cleaning Fluid & Novec™ 71IPA Replacement | ASI 71IPA appeared first on ASI Technologies.

Modern HFE co-solvent cleaning processes are available options if a short process, drying time and/or water-free cleaning is required.  This is often utilized in the military and aerospace industries. HFEs (hydrofluoroethers) were developed as a replacement for CFCs or similar solvents exhibiting the following properties: nonflammable, non-conductive, dries quickly and residue-free.

With a co-solvent, HFE is used in a cleaning bath with spray-under-immersion or ultrasonic agitation in order to dissolve persistent residues. The rinsing step takes place in a bath with HFE only and subsequently with steam rinsing. The substrates are then dried by intensive cooling. This process must be carried out in a cleaning machine with efficient cooling technology, preventing the evaporation of HFE.

The post Zestron | HFE Water-free Co-Solvent appeared first on ASI Technologies.

Specifications:

• Non-flammable
• Non-conductive
• Low toxicity
• Low Global Warming Potential (GWP)
• Zero ozone depletion potential
• Low surface tension penetrates tight spaces for improved cleaning

The post 3M™ | Novec™ 71IPA Light Cleaning and Degreasing appeared first on ASI Technologies.