Rework Stations - ASI Technologies

MARTIN | EXPERT 10.6 HVX 5,300W REWORK STATION

keren many — Mon, 25 Dec 2023 15:15:20 +0000

Rework Station with 5,300 W hybrid under-heating system. The heating area of 450 x 420 mm² is adjustable to PCB size. Automated SMD placement process by Auto Vision Placer (AVP) incl. EASYSOLDER 07 software package and DBL 06 control unit with six high resolution sensors inputs for thermocouples (Type K).

This system is particularly suitable for large size PCBs like PCs, Laptops and Server Boards with small up to very big components.

Top Features

Camera-supported rework

Flexibility

Various PCB sizes and shapes as well as components available up to 75 x 75 mm²

Under-heating system

Large PCBs 480 x 480 mm²

Performance

Uniform heat distribution through convection and hybrid technology

Multifunctionality

One device for all processes, including de-soldering, pad cleaning, automatic positioning and soldering

Process control

Automatic profiler for under- and top-heating systems

Software

Simple, intuitive, tablet-compatible

Standard equipment

Tool set for dispensing, placing, residual solder removal and soldering with magazine
Set of placement nozzles XL-type (BGA/CSP) 5 mm, 8 mm, 15 mm with O-Ring
Set of solder nozzles (BGA) 15 mm, 27 mm, 35 mm, 40 mm
Two camera lenses (BGA und CSP)
Two thermocouple sensors (type K)
Four PCB magnet holder 40,5 mm (standard)
Three PCB clips to install at hand rest
Foot switch
Manual
Intuitive software EASYSOLDER 07 with touch integration

Components

LED rework/Daughter boards/Interposer boards/Sub assemblies/RF frames/RF shields/

Rework on flex/Small passives down to 0402/SON/PGA/LGA/QFP/PoP/DFN/QFN/µBGA/CSP

BGA up to 67x67mm/Sockets/Connectors/CPU/Under-filler or coated components/Film capacitor.

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MARTIN | EXPERT 10.6 HV 3300W REWORK STATION

keren many — Mon, 25 Dec 2023 15:04:36 +0000

Semiautomatic hybrid Rework station for repairing BGA, CSP and QFP components on medium-sized circuit boards

The Rework Station with 3,300W hybrid under heater. The heating area of 275 x 245 mm² is adjustable to PCB size. Automated SMD placement process by Auto Vision Placer (AVP) incl. EASYSOLDER software package and DBL 06. control unit with six high resolution sensors inputs for thermocouples (Type K). This system is particularly suitable for mid-size and large PCBs with fine-pitch components of varying package dimensions.

Top Features

Camera-supported rework

Flexibility

Various PCB sizes and shapes as well as components available

Under-heating system

Highest energy density for thermally demanding boards.

Performance

Uniform heat distribution through convection and hybrid technology

Multifunctionality

One device for all processes, including de-soldering, pad cleaning, automatic positioning and soldering

Software

Simple, intuitive, tablet-compatible

Precision

Precision of placement within 15 µm

Standard equipment

Tool set for dispensing, placing, residual solder removal and soldering with magazine
Set of placement nozzles (BGA/CSP) 3 mm, 5 mm, 8 mm, 10 mm
Set of solder nozzles (BGA) 15 mm, 27 mm, 35 mm, 40 mm
Two camera lenses (BGA und CSP)

Two thermocouple sensors (type K)
Four PCB magnet holder 40,5 mm (standard)
Two PCB clips to install at hand rest
Foot switch
Intuitive software EASYSOLDER 07 with touch integration

Components

LED rework /Daughter boards Interposer boards/ Sub assemblies /RF frames /RF shields Rework on flex /Small passives down to 0402 /SON /PGA /LGA /QFP /PoP /DFN /QFN/ µBGA/CSP /BGA Sockets /Connectors /CPU /Under-filler or coated components /Film capacitor.

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MARTIN | EXPERT 10.6 RS 5,300 W REWORK STATION

keren many — Mon, 25 Dec 2023 14:45:46 +0000

Semi-automatic rework station with gantry system for small to very large components
Top Features Camera-supported rework Flexibility
Good accessibility of all components on the board via the gantry system & compact footprint at the same time
Under-heating system
Large PCBs 500 x 500 mm²

Performance
High cycle time due to easy prepositioning of the arm via gantry system
Multifunctionality
One device for all processes, including de-soldering, pad cleaning, automatic positioning and soldering!
Process control
Automatic profiler for under- and top-heating systems; Repeatable placement
Software
Simple, intuitive, tablet-compatible

Standard equipment
Set of placement nozzles XL-type (BGA/CSP) 5 mm, 8 mm, 15 mm with O-Ring
Set of solder nozzles (BGA) 15 mm, 27 mm, 35 mm, 40 mm
Two camera lenses (BGA, CSP)
Two thermocouple sensors (type K)
Four PCB magnet holder 40.5 mm (standard)
Two PCB clips to install at hand rest
Intuitive software EASYSOLDER 07 with touch integration

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Hot air station ASI912

kramer.niels — Mon, 01 Apr 2019 12:04:26 +0000

This hot air rework station uses heating device to warm up air which can be used to weld.
With 3 memory channels : CH1, CH2 and CH3, after setting the temperature, airflow and time, it can be easily switched according to your needs.
Equipped with magnetic sensor, as long as holding the handle, the machine can quickly work. When handle put in frame, the machine will cool down to 100℃ and enter standby mode.
With auto sleep function, can set up while sleep status.
Sensors closed loop, Zero-crossing triggering microcomputer temperature control, LCD touch screen. Warming up quickly, accurate and stable temperature control, make it real lead-free welding.
Using frequency conversion blower, which has adjustable, large range air flow, can achieve a variety of purposes.
Auto air cooling function makes the machine more durable and long-lasting.

54095

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XYTRONIC | IR860 Solderlight

zivit.drori — Mon, 04 Jun 2018 10:28:59 +0000

The Taiwan based XYTRONIC INDUSTRIES LTD manufacturer of Infrared BGA Rework Stations. All of their products comply with international quality standards and are greatly appreciated all over the world.

BGA Rework Station
The IR860 solderlight is specially designed for SMD/BGA rework and also very convenient for re-balling smaller BGA components. When used in conjunction with our infra-red pre-heater, the system will achieve remarkable improvements in quality and efficiency of SMD/BGA rework operations.

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Thermaltronics | TMT-HA600 Hot Air Tool

zivit.drori — Mon, 04 Jun 2018 10:27:37 +0000

The TMT-HA600 hot air tool uses a large diaphragm pump and a high power 1300W heater, designed to work on more difficult applications, in the removal and reflow of surface mount components.

Fast heating and temperature recovery
Simple controls allows easy adjustment
Uses HTN Series Hot Air Nozzles
Digital display with easy-to-adjust temp and airflow

P/N TMT-HA600-2

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Thermaltronics | TMT-HA300 Hot Air Tool

zivit.drori — Mon, 04 Jun 2018 10:26:05 +0000

The TMT-HA300 hot air tool uses a large diaphragm pump and can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others.

Digital display shows temperature and status.
Airflow meter provides visual feedback of air flow.
Large selection of high quality nozzles.

Adjustable, easy to use temperature and air control knobs

P/N TMT-HA300

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Thermaltronic | TMT-HA100 Hot Air Pencil

zivit.drori — Mon, 04 Jun 2018 10:23:49 +0000

The TMT-HA100 hot air pencil is designed to remove and reflow small precision components, integrated circuits and other smaller devices.

ESD safe design with integrated ground
Specialized for work on precision components.
Uses HAP Series Hot Air Pencil Nozzles
High quality heating element ensures fast heat up and long heater life

P/N TMT-HA100

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ASI | 706 Heating Gun

zivit.drori — Mon, 04 Jun 2018 10:22:06 +0000

Ergonomic handle skidproof design and special grip feeling material,
comfortable hold feeling
Eddy air outlet, soft and centralized air volume, not damage the device
CPU PID control the temperature, LCD displays the temp,
can be set randomly
Built-in high precision sensor, accurate and stable temperature
Adopts Japan Mabuchi Motor, high efficiency, long life
The characteristic heater, longer life when continuous work
SMD technology, stable and reliable performance

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ASI | R720 LED BGA SMD Rework-Station

zivit.drori — Mon, 04 Jun 2018 10:21:03 +0000

ASI-R720 BGA/LED Rework System

Stable and Uniform Hot Air Heating System
Lower Heater Adjustable
Carbon Fiber Micro-crystalline Infrared Preheater
High-Precision PID Temperature Control System
High-Precision Optical Alignment System with Industrial High-Definition CCD (2MP)
High-Resolution Touch Screen HMI Interface
Automatic Placement, Desoldering
Built-In Pressure Testing Device To Protects The PCB
Real-Time Temperature Monitoring and Over-Temperature Protection.
Emergency Stop Function

Application

Suitable for Normal SMD (BGA, QFP etc.) & Micro-SMD Components Repair, Support P08 Small pitch LED beads, Min. 0.5mm * 0.5mm IC.

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ASI | IR710+ SMD BGA Rework System

zivit.drori — Mon, 04 Jun 2018 10:20:18 +0000

Microprocessor-controlled ESD safe unit.
Utilizes infrared heat wave technology.
Easy-to-adjust IR and pre-heat temperatures with digital display.
Embedded pre-heating station.
Widely used for reworking BGAs, micro BGAs, QFPs, PLCCs, SOICs, small SMD, and other circuit board components.
Unique, innovative mechanical design for more precise soldering; eliminates the displacement of surrounding components brought by unnecessary or accidental movements during reworking.
Integrated hands-free IR gun.
Centigrade and Fahrenheit switchable.

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