ZESTRON® SW is a solvent-based cleaner with a high flash point, specifically designed for use in SMT printers without vacuum drying. With reproducible cleaning results and residue-free drying, the reliability of printing processes is greatly increased.

Advantages compared to other surfactant cleaners:

• Ideal for removing leaded and lead-free solder pastes from the stencil underside
• Dries fast and residue free
• Good delineation stability and reduced solder balling (see Technical Information 4)
• High flash point (67°C/153°F) for safe printer operation
• Halogen free

The post Zestron | SW Solvent-based SMT Cleaner appeared first on ASI Technologies.

VIGON® UC 160 based on MPC® Technology, is an aqueous-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printers. With low evaporative losses and effective wettability, product consumption is minimized and wipe cycles are reduced for optimal line operation.

Advantages compared to other cleaners:

• Ideal for cleaning leaded and lead free solder paste from fine pitch stencil apertures during stencil underside wipe applications
• Due to its water-based formulation, this cleaning agent evaporates significantly more slowly than IPA, limiting evaporative losses
• No flash point and evaporates residue free
• Aqueous-based, surfactant-free cleaner with excellent material compatibility on all wetted parts (stencils & printers)
• No scaling or residue build up
• Halogen free
• Low odor

The post Zestron | Vigon UC160 Aqueous-based Cleaning Agent appeared first on ASI Technologies.

VIGON® SC 210, based on the MPC® Technology, is an aqueous-based cleaning agent specifically developed to clean SMT stencils. The cleaning agent reliably removes solder pastes and SMT adhesives in a single process and provides excellent cleaning results, even at low temperatures. VIGON® SC 210 is designed to be used in spray-in-air and ultrasonic cleaning systems.

Advantages compared to other surfactant cleaners:

• Consistently good cleaning results at temperatures between 18-40°C/64-104°F
• High bath loading capability providing extended bath life and reduced cleaning agent costs
• Aqueous-based, surfactant-free cleaner; leaves no residues on substrates or inside the equipment
• Excellent material compatibility
• No flash point and thus, can be used without explosion-proof protection
• Non-foaming when used in spray-in-air and ultrasonic systems
• Halogen free
• Low odor

The post Zestron | VIGON® SC210 Aqueous-based Cleaning Agent appeared first on ASI Technologies.

VIGON® SC 202, based on MPC® Technology (Micro Phase Cleaning), is an aqueous-based cleaning agent designed for the reliable removal of solder pastes and SMT adhesives from stencils. The product has also been developed to clean double-sided misprints, with one side already soldered. The cleaning agent is recommended to be used in spray-in-air and ultrasonic cleaning systems.

Advantages compared to other surfactant cleaners:

• Specifically developed for the removal of fluxes from doublesided misprinted boards with one side soldered
• Easily filtered and therefore provides an extended bath life and reduces cleaning agent costs
• Surfactant-free and can be easily rinsed residue-free
• No flash point and can be used in equipment without explosion proof protection
• The cleaner is applicable in spray-in-air systems and ultrasonic dip tanks
• No foaming when used in spray-in-air systems
• Halogen free
• Low odor

The post Zestron | VIGON® SC202 Aqueous-based Cleaning Agent appeared first on ASI Technologies.

VIGON® SC 200, based on the MPC® Technology (Micro Phase Cleaning), is a aqueous-based cleaning agent designed to clean SMT stencils at room temperature. The cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can also be used for stencil underside wipe processes in printers. It is designed for use in spray-in-air and ultrasonic cleaning systems and is also recommended for the cleaning of misprinted solder paste. Depending on the type of flux, VIGON® SC 200 can also be suggested for both double-sided and single-side soldered circuit boards.

Advantages compared to other surfactant cleaners:

• Consistently good cleaning results at temperatures between 18-40°C / 64-104°F
• High bath loading capability providing extended bath life and reduced cleaning agent costs
• Aqueous-based, surfactant-free cleaner; leaves no residues on substrates or inside the equipment
• Excellent material compatibility
• No flash point and thus, can be used without explosion-proof protection
• Non foaming when used in spray in air and ultrasonic systems
• Halogen free
• Low odor

The post Zestron | Vigon SC200 Aqueous-based Stencil Cleaner appeared first on ASI Technologies.

The ZESTRON® Flux Test Kit indicates carboxylic-based flux activators through a color reaction.  This qualitative test is an important supplement to the ionic contamination measurement as non-visible residues can be easily detected.  Additionally, this test helps to identify the local distribution of contamination which in turn provides valuable data pertaining to short-term and long-term failures.

Advantages:

• The distribution of local contamination helps to determine the climatic reliability of electronic assemblies
• Quick and easy test method. No extensive training required
• No special test equipment needed
• No additional floor space requirements
• Can be used throughout the facility
• Low cost per tested part

The post Zestron | Flux Test appeared first on ASI Technologies.

The ZESTRON® EYE is designed for ZESTRON cleaning agents and provides:

Precise and automatic concentration measurement for fresh and loaded cleaning baths

• Ensures a stable and reliable cleaning process
• Real time cleaner concentration management
• Enables quick response to changes in wash bath concentration
• Continuous data storage of monitored parameters
• Allows process traceability consistent with quality assurance programs
• Digital touch screen controller
• Easy to use operator interface
• Ability to integrate within the cleaning equipment control system
• Enables automated dosing for wash bath concentration management

The post Zestron | EYE Automatic Concentration Monitoring System appeared first on ASI Technologies.

Advantages compared to other cleaners:

• Due to its neutral pH value, it demonstrates an unprecedented level of material compatibility with sensitive materials such as aluminum, brass, copper, plastics, labels and inks
• Performs well at low application concentrations in specific processes
• No need for waste water neutralization
• Halogen-free

The post Zestron | Vigon N600 Aqueous-based, pH neutral Defluxing Agent for spray-in-air cleaning processes appeared first on ASI Technologies.

Advantages compared to other surfactant cleaners:

• Due to its polar and nonpolar components, it is suitable for a wide range of applications
• Completely distillable and therefore suitable for one chamber vapor degreaser processes with vacuum distillation and vapor rinsing
• Halogen and surfactant-free
• Dries residue-free
• Ideal for use in water-free applications, especially when water rinsing is restricted
• Ideal for cleaning capillary spaces, such as underneath BGA’s and flipchips
• Applicable for stencil cleaning and underside wipe processes in SMT printers

The post Zestron | VD Solvent-based Cleaning Medium for Defluxing appeared first on ASI Technologies.

Advantages compared to other cleaners:

• Due to its neutral pH value, it demonstrates an unprecedented level of material compatibility with sensitive materials such as aluminum, brass, copper, plastics, labels and inks
• Performs well at low application concentrations in specific processes
• No need for waste water neutralization
• Halogen-free

The post Zestron | Vigon N600 Aqueous-based, pH neutral Defluxing Agent for Spray-in-air Cleaning Processes appeared first on ASI Technologies.

VIGON® A 250, based on the MPC® Technology (Micro Phase Cleaning), is an aqueous-based cleaning agent designed specifically for low and medium pressure spray-in-air processes with long exposure times. It is recommended for removing a wide range of flux residues from electronic assemblies. VIGON® A 250‘s mild formulation is particularly gentle on all solder joints and materials.

Advantages compared to other surfactant cleaners:

• Specifically developed for batch cleaning applications
• Ability to remove a wide range of flux residues
• Excellent material compatibility, even with long contact times
• High bath loading capacity ensures an extended bath life, low maintenance costs and reduced costs per cleaned part
• Surfactant-free formulation prevents the formation of white residues on cleaned parts as well as cleaning equipment and eliminates time consuming surfactant monitoring
• Mild formulation results in shiny solder joints and low ionic contamination values

The post Zestron | Vigon A 250 Aqueous-based Defluxing Agent for low and medium Pressure Cleaning Processes appeared first on ASI Technologies.

Advantages compared to other surfactant cleaners:

• Specifically developed for inline cleaning applications
• Ability to clean a wide range of flux residues
• Excellent cleaning results even in cleaning processes with short exposure time
• High bath loading capacity ensures an extended bath life, low maintenance costs and reduced costs per cleaned part
• Surfactant-free formulation eliminates the formation of white residues on cleaned parts as well as cleaning equipment and eliminates time-consuming surfactant monitoring
• Does not foam, even in high pressure applications
• Halogen free

The post Zestron | Vigon A 201 Aqueous-based Defluxing Agent for High Pressure Cleaning Processes appeared first on ASI Technologies.

Advantages compared to other surfactant cleaners:

• Clean Air Solvent certified product
• Specifically formulated for excellent compatibility with aluminum and epoxy surfaces
• VOC content of less than 25 g/l at its recommended concentration of 5%
• Halogen-free
• Low odor

The post Zestron | Atron AC300 Aqueous-based Cleaning Medium for Flux Removal appeared first on ASI Technologies.

Advantages compared to other surfactant cleaners:

• Due to its mild formulation and the low operating concentration, the cleaning agent demonstrates a superior level of material compatibility with sensitive metals such as aluminum, brass, nickel, etc.
• Excellent cleaning performance, at low concentrations and temperatures
• Allows for a quicker removal of a wide variety of the latest lead-free and eutectic flux residues
• Exceptionally longer bath life (3 to 10 times) than traditional surfactant-based cleaners
• Gentle formulation leaves solder joints and pads shiny and bright

The post Zestron | Atron AC207 Aqueous-based Cleaning Medium for Defluxing Applications in Spray-in-air Processes appeared first on ASI Technologies.

ATRON® AC 205 is a FAST® Technology based cleaning agent specifically designed to remove flux residues from electronic assemblies. The product was developed to improve the cleaning performance and bath life of traditional surfactant-based cleaners, thereby significantly reducing overall cleaning costs. ATRON® AC 205’s mild formulation is particularly gentle on all materials and solder joints. ATRON® AC 205 can be used as a drop-in replacement for high and medium pressure, inline and batch cleaning systems.

Advantages compared to other surfactant cleaners:

• Ethanolamine-free
• Enables fast removal of a wide variety of the latest lead-free and eutectic flux residues
• 3 to 10 times longer bath-life than traditional surfactant cleaners
• The non-foaming formula does not promote “white scaling”
• Gentle formulation leaves solder joints and pads shiny and bright
• Low odor

The post Zestron | Atron AC 205 Flux Residues Remover appeared first on ASI Technologies.

Advantages compared to other surfactant cleaners:

• High bath loading capability results in long bath life
• Does not require any specific explosion-proof environment
• Due to the surfactant-free formulation, it is easily rinsed
• Increases wire bonding/molding quality for power modules, leadframe-based discrete components and Power LEDs
• Ensures a void-free underfill and improves the image resolution by removing all tacky fluxes from Flip Chips/CMOS
• Has been EMPF Phase II tested and MIL approved
• Listed on the ESA ‘list of declared materials’

The post Zestron | FA+Solvent-based Medium for PCB Flux Removal appeared first on ASI Technologies.

Modern HFE co-solvent cleaning processes are available options if a short process, drying time and/or water-free cleaning is required.  This is often utilized in the military and aerospace industries. HFEs (hydrofluoroethers) were developed as a replacement for CFCs or similar solvents exhibiting the following properties: nonflammable, non-conductive, dries quickly and residue-free.

With a co-solvent, HFE is used in a cleaning bath with spray-under-immersion or ultrasonic agitation in order to dissolve persistent residues. The rinsing step takes place in a bath with HFE only and subsequently with steam rinsing. The substrates are then dried by intensive cooling. This process must be carried out in a cleaning machine with efficient cooling technology, preventing the evaporation of HFE.

The post Zestron | HFE Water-free Co-Solvent appeared first on ASI Technologies.

Advantages compared to other cleaners:

• Especially suitable for the removal of resin-based flux residues
• This product dries very fast and residue-free
• Easy-to-use, for both manual and automatic cleaning in explosion-proof equipment
• Very suitable as a cleaning and rinsing agent

The post Zestron | Vigon EFM Precision Cleaning Medium for Manual Flux Removal appeared first on ASI Technologies.

As the successor to VIGON® RC 101, VIGON® RC 303 delivers improved cleaning performance along with increased operator safety.

Advantages of VIGON® RC 303 compared to other cleaners:

• Improved cleaning performance
• Direct application to warm surfaces (40-50°C / 104-122°F) possible as a result of no flash point
• Decreased soaking time improves overall cleaning process and minimizes equipment downtime
• Excellent material compatibility with aluminum and epoxy surfaces
• Improved formulation with reduced VOC emissions
• Environmentally friendly
• Low odor

Advantages of cleaning with VIGON® RC 303 in wave solder systems:

• Reduced cleaning agent consumption compared to IPA
• Operator safety improved as a result of no flashpoint and lower VOC emissions

The post Zestron | Vigon RC 303 Water-based Cleaning Agent for Reflow Ovens and Wave Solder Systems appeared first on ASI Technologies.

ATRON® SP 200 is an aqueous-alkaline surfactant cleaner, specifically developed to remove baked-on fluxes from solder pallets and condensation traps. ATRON® SP 200 can be used for the removal of unsoldered solder pastes from SMT stencils. The cleaner can be used in air assisted, spray-in-air and ultrasonic cleaning equipment.

Advantages compared to other surfactant cleaners:

• Simple, easy-to-use handling
• 3 to 10 times longer bath life than traditional surfactant cleaners
• Reduced number of bath changes results in a lower volume of used cleaner that requires disposal, thereby reducing process costs
• Excellent compatibility with aluminum and epoxy surfaces
• Does not leave residues on cleaning equipment
• No build-up of organics in the rinsing section
• Suitable for cleaning conveyor fingers and the removal of extremely baked-on flux residues in solder ovens and similar applications
• Halogen free
• Low VOC product
• Clean Air Solvent certified product

The post Zestron | Atron SP 200 Aqueous-based Cleaning Medium for Baked-on Flux Removal appeared first on ASI Technologies.