The PDR IR-E6 is the ultimate platform for extra-large PCBs used in aerospace, automotive, and defense industries. It combines a gantry-mounted IR head with powerful preheating for the most demanding thermal requirements.

Key Features:

• XL PCB Capacity: Designed for boards up to 460 × 620 mm (18″ × 24″).
• Gantry-Mounted Top Heater: 150W Focused IR head for easy positioning across large surfaces.
• High-Power Preheating: 4000W 3-zone Dark IR preheater for high-mass components.
• Dual-Camera Alignment: Split Beam Prism system with Gig-E cameras for flawless alignment.
• Advanced Thermal Control: Supports layered profiles and real-time reflow observation.

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The PDR IR-E3 is a cost-effective, high-yield rework solution. It features Focused IR heating and Closed-Loop thermal control, making it ideal for laboratories, field repairs, and small-batch production.

Key Features:

• Contact-Free IR Heating: Precise thermal delivery to SMD and BGA components without collateral damage.
• Closed-Loop Thermal Control: Dual non-contact IR sensors for the component and PCB.
• ThermoActive Software: Simplifies the rework process with repeatable thermal profiles.
• Versatile PCB Capacity: Supports boards up to 300 × 450 mm.
• Tool-Free Operation: Gas-free and nozzle-free technology for a clean, complication-free process.

The post PDR IR-E3 – Entry-Level IR Rework Station appeared first on ASI Technologies.

The IR-Q3 system from PDR is engineered for professional rework of SMD, BGA, CSP, QFN, LED, and RoHS components. Utilizing Focused Infrared heating technology, the system provides a smart, intuitive experience with a proven 98% yield in BGA repairs.

Key Features:

• Focused IR Top Heater: 150W precise, contactless heating with adjustable spot sizes.
• 3-Zone Quartz PCB Preheater: 3250W Dark IR system for fast and even heating.
• Split Beam Optical Alignment: Provides simultaneous viewing of PCB and component for accuracy up to 5µm.
• Closed-Loop Thermal Control: Non-contact IR sensors monitor both the component and PCB in real-time.
• ThermoActive Software Suite: Advanced thermal profiling and automatic process control.
• Reflow Process Observation: High-resolution camera for real-time visual monitoring.
• Pick & Place Mechanism: Automatic component removal and placement with “soft landing” capability.
• Modular Design: Fully upgradeable platform to meet changing production needs.
• 2-Year Warranty: Comprehensive manufacturer support.

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